| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Renesas Electronics America |
WAFER (UNSAWN) - BOX |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Texas Instruments |
IC PROG SENSOR SGNL COND DIE |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Maxim Integrated |
EMBEDDED MODULE WITH OPTICAL AFE |
11961470 |
|
|
ScioSense |
IC STRAIN GAUGE AFE DEVICE DIE |
10 |
|
|
Rochester Electronics |
IC PROCESSOR CCD 14BIT LFCSP |
2430 |
|
|
Rochester Electronics |
10-BIT CCD SIGNAL PROCESSOR |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Azoteq |
3 CH, GPIO-SWIPE AND TAP ONLY |
0 |
|
|
Renesas Electronics America |
WAFER (UNSAWN) - BOX |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - FRAME |
0 |
|
|
Renesas Electronics America |
WAFER (UNSAWN) - BOX |
0 |
|
|
Rochester Electronics |
DAC, 12-BIT, 1 CHANNEL, PBGA105 |
3651 |
|
|
Renesas Electronics America |
WAFER (UNSAWN) - BOX |
0 |
|
|
Renesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
0 |
|