| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
NON SIL PUTTY, 3.5 W/M K, 50ML |
0 |
|
|
 |
Wakefield-Vette |
FAST CURING THERMALLY CONDUCTIVE |
17 |
|
 |
Ellsworth Adhesives |
THERMAL ADHESIVE GRAY 25ML KIT |
11 |
|
 |
t-Global Technology |
NON-SILICONE PUTTY 30CC GREY |
15 |
|
 |
Parker Chomerics |
THERM-A-GAP TC50 5.2W/M-K 30CC |
155 |
|
 |
Laird - Performance Materials |
TPUTTY 506 75CC CARTRIDGE |
0 |
|
 |
t-Global Technology |
THERMAL NON-SILICONE PUTTY 1LB |
5 |
|
 |
MG Chemicals |
SLOW CURE THERM COND ADH FLOW |
29 |
|
 |
Chip Quik, Inc. |
HEAT SINK COMPOUND - GREY ULTRA |
0 |
|
 |
Chip Quik, Inc. |
HEAT SINK COMPOUND - HIGH DENSIT |
175 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 1LB L |
19 |
|
 |
ITW Chemtronics (Chemtronics) |
HEAT SINK GREASE BORON NITRIDE |
363 |
|
 |
3M |
SILICONE PASTE 8 OZ CLEAR |
97 |
|
 |
t-Global Technology |
EPOXY POTTING COMPOUND BLACK/YEL |
94 |
|
 |
3M |
ADHESIVE THERM COND 50ML |
0 |
|
 |
Henkel / Bergquist |
LF3800LVO-00-600CC BERGQUIST LIQ |
0 |
|
 |
Henkel / Bergquist |
GAP FILLER 4000 50CC CARTRIDGE |
0 |
|
 |
Parker Chomerics |
THERM-A-GAP GEL45 30CC EFD SYR |
134 |
|
 |
Techspray |
SILICONE FREE HEAT SINK |
22 |
|
 |
Parker Chomerics |
THERM-A-FORM CIP35 POTTING 200CC |
78 |
|