Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
1780

1780

Adafruit

AUDIO ADAPTER BOARD FOR TEENSY 3

0

1651

1651

Adafruit

2.8" TFT RESISTIVE TOUCH SHIELD

109

2945

2945

Adafruit

NEOPIXEL FEATHERWING

73

3343

3343

Adafruit

CRICKIT FEATHERWING FOR ANY FEAT

52

4886

4886

Adafruit

ADAFRUIT AW9523 GPIO EXPANDER AN

36

1171

1171

Adafruit

SMALL-SIZE PERMA-PROTO RASPBERRY

0

2310

2310

Adafruit

PERMA-PROTO HAT FOR PI MINI KIT

438

4530

4530

Adafruit

LPS25 PRESSURE STEMMA QT / QWIIC

2

2345

2345

Adafruit

LED MATRIX RGB HAT RTC RASP PI

285

1989

1989

Adafruit

PI T-COBBLER PLUS KIT

122

4469

4469

Adafruit

MLX90640 IR THERM CAMERA 110DEG

106

3527

3527

Adafruit

ADAFRUIT PIOLED - 128X32 MONOCHR

1754

4098

4098

Adafruit

2.7" TRI-COLOR EINK / EPAPER DIS

15

4479

4479

Adafruit

TRIPLE-AXIS MAGNETOMETER LIS3MDL

103

4740

4740

Adafruit

ADAFRUIT MIDI FEATHERWING KIT

34

4264

4264

Adafruit

AIRLIFT FEATHERWING ESP32 WIFI

206

3928

3928

Adafruit

CRICKIT FOR MICRO:BIT

9

3436

3436

Adafruit

MUSIC MAKER FEATHERWING W/ AMP -

42

4488

4488

Adafruit

3-AXIS LIS2MDL STEMMA QT / QWIIC

21

4494

4494

Adafruit

BAROMETRIC PRESSURE / ALTITITUDE

46

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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