| Manufacturer Part | FI-XB30SRL-HF11-R3000 |
|---|---|
| Manufacturer | JAE Electronics |
| Description | CONN RCPT 30P 0.039 GOLD SMD R/A |
| Category | Connectors, Interconnects |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | FI-XB30SRL-HF11-R3000 PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 06 - Dec 10 2024 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | FI-X |
| Package: | Tape & Reel (TR) |
| Part Status: | Obsolete |
| Connector Type: | Receptacle |
| Contact Type: | Non-Gendered |
| Style: | Board to Cable/Wire |
| Number of Positions: | 30 |
| Number of Positions Loaded: | All |
| Pitch - Mating: | 0.039" (1.00mm) |
| Number of Rows: | 1 |
| Row Spacing - Mating: | - |
| Mounting Type: | Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount |
| Termination: | Solder |
| Fastening Type: | Friction Lock |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 12.0µin (0.30µm) |
| Insulation Color: | Black |
| Insulation Height: | - |
| Contact Length - Post: | - |
| Operating Temperature: | -40°C ~ 80°C |
| Material Flammability Rating: | UL94 V-0 |
| Contact Finish - Post: | Tin |
| Mated Stacking Heights: | - |
| Ingress Protection: | - |
| Features: | Grounding Pins, Shielded, Solder Retention |
| Current Rating (Amps): | 1A per Contact |
| Voltage Rating: | 200V |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
IC EEPROM 1KBIT 1-WIRE 6TSOC
CONN RCPT 30P 0.039 GOLD SMD R/A
