| Manufacturer Part | EMBP01-F171-H3100 |
|---|---|
| Manufacturer | EM Microelectronic |
| Description | NEXT GENERATION BLE V5.0 ENCAPSU |
| Category | RF/IF and RFID |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 100 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Nov 24 - Nov 28 2024 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| RF Family/Standard: | Bluetooth |
| Protocol: | Bluetooth v5.0 |
| Modulation: | - |
| Frequency: | 2.4GHz |
| Data Rate: | - |
| Power - Output: | 6dBm |
| Sensitivity: | - |
| Serial Interfaces: | - |
| Antenna Type: | Antenna Not Included |
| Utilized IC / Part: | - |
| Memory Size: | - |
| Voltage - Supply: | 2.3V ~ 3.6V |
| Current - Receiving: | - |
| Current - Transmitting: | - |
| Mounting Type: | Chassis Mount |
| Operating Temperature: | -20°C ~ 60°C |
| Package / Case: | Module |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
NEXT GENERATION BLE V5.0 ENCAPSU
