| Manufacturer Part | BGA0034-S |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Description | BGA-676 (1.0 MM PITCH, 26 X 26 G |
| Category | Soldering, Desoldering, Rework Products |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 20 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Nov 24 - Nov 28 2024 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | Proto-Advantage BGA |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions: | 676 |
| Pitch: | 0.039" (1.00mm) |
| Outer Dimension: | 2.600" L x 1.800" W (66.04mm x 45.72mm) |
| Inner Dimension: | 1.024" L x 1.024" W (26.00mm x 26.00mm) |
| Thermal Center Pad: | - |
| Material: | Stainless Steel |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
BGA-676 (1.0 MM PITCH, 26 X 26 G
