70-1608-0804

Manufacturer Part 70-1608-0804
Manufacturer Kester
Description SOLDER PASTE NO CLEAN 100GM
Category Soldering, Desoldering, Rework Products
RoHS Lead free / RoHS Compliant
Warranty 365 days
Datasheet 70-1608-0804 PDF
Availability 0 pieces
Shipped from HK warehouse
Expected Shipping Nov 25 - Nov 29 2024
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In Stock Min.: 1 Mult.: 1

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Product Attributes
Type Description
Series:R276
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 424°F (217 ~ 218°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Syringe, 3.53 oz (100g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
More Information
70-1608-0804
70-1608-0804
Kester 70-1608-0804 is available at Ample-Chip.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Documents
Datasheet
70-1608-0804 PDF
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Payment
Payment method Hand Fee
Telegraphic Transfer Request service
Paypal 4% fee
Credit Card 4% fee
Western Union Free of charge
Money Gram Free of charge
Shipping
Shipping Type Lead Time
DHL 2-5 days
Fedex 2-5 days
UPS 2-5 days
TNT 2-6 days
EMS 3-7 days
Registered Air Mail 20-35 days
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SOLDER PASTE NO CLEAN 100GM

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