| Manufacturer Part | TC1-200G |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Description | HEAT SINK COMPOUND - HIGH DENSIT |
| Category | Fans, Thermal Management |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Nov 24 - Nov 28 2024 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Silicone Compound |
| Size / Dimension: | 200 gram Jar |
| Usable Temperature Range: | - |
| Color: | White |
| Thermal Conductivity: | 0.67W/m-K |
| Features: | - |
| Shelf Life: | 60 Months |
| Storage/Refrigeration Temperature: | 37°F ~ 77°F (3°C ~ 25°C) |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
HEAT SINK COMPOUND - HIGH DENSIT
