Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
101020593 Seeed	GROVE - COULOMB COUNTER 3.3V TO	29
103020132 Seeed	GROVE 2CHANNEL SPDT RELAY	0
114992260 Seeed	IMX219-77 8MP CAMERA WITH 77 FOV	37
103020137 Seeed	GROVE SOLID STATE RELAY V2	1
110060001 Seeed	SEEEDUINO MEGA PROTOSHIELD KIT	0
101020652 Seeed	GROVE 2.5A DC CURRENT SENSOR	96
101020852 Seeed	GROVE - ANALOG MICROPHONE	40
101020081 Seeed	GROVE - 6-AXIS ACCELEROMETER&COM	0
101990052 Seeed	TESSEL IR MODULE	0
103990563 Seeed	2-CHANNEL CAN-BUS(FD) SHIELD FOR	22
113020007 Seeed	GROVE BLE	5
105020001 Seeed	GROVE I2C MOTOR DRIVER	0
114991988 Seeed	POE HAT FOR ROCK PI 4	1
107020001 Seeed	GROVE SPEAKER	27
103020027 Seeed	GROVE - MEGA SHIELD V1.2	87
104020169 Seeed	GROVE - RGB LED (WS2813 MINI)	120
101020063 Seeed	GROVE LOUDNESS SENSOR	22
105020074 Seeed	GROVE - LED MATRIX DRIVER (HT16K	155
103020293 Seeed	GROVE - 8 CHANNEL I2C MULTIPLEX	41
114990852 Seeed	CRAZYFLIE MICRO SD CARD DECK	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems