Japan joins the United States to promote the localization of advanced chip production. On November 11, the Ministry of Economy, Trade and Industry of Japan announced a policy to promote the design and manufacture of a new generation of semiconductors in the mid to late 2020s. The specific measures are two aspects: to establish an advanced process chip research and development center with the United States, and at the same time, the Japanese government and Japanese companies jointly funded and established an advanced process chip company called "Rapidus".
According to the announcement, Japan will "revive" Japan's domestic semiconductor production in three steps. The first step, starting from 2020, to strengthen the Internet of Things (IoT) semiconductor product portfolio; the second step, starting from 2025, to strengthen Japan-US ties and acquire new-generation semiconductor technologies from the Japan-US joint project; The third step, 2030 Since then, by strengthening global cooperation, we will realize future technologies such as optoelectronic fusion integration technology.
Rapidus will cooperate with companies such as IBM in the United States to develop 2-nanometer semiconductor technology, establish a short turnaround time (TAT) test line, and introduce EUV lithography equipment. According to reports, the new company will develop high-end chips related to artificial intelligence and smart city construction, and plans to form mass production in 2027.
"Semiconductors will be a key component in the development of new frontier technologies such as artificial intelligence, digital industries and healthcare," Nishimura said.
According to the plan of the Ministry of Economy, Trade and Industry of Japan, Rapidus will be invested 1 billion yen by Toyota, Sony, Softbank, Kioxia, Nippon Denso, Nippon Electric, and Nippon Telecom Telephone, and 300 million yen by Mitsubishi UFJ Bank.
