Infineon and Supermicro collaborate to reduce power consumption in data centers with semiconductors from Infineon

Infineon OptiMOS™ Integrated Power Stage Semiconductor TDA21490

[October 26, 2022, Munich, Germany] Digitization has ushered in a new era. In the future, as a large number of digital applications such as video streaming, online meetings, cloud services, and cryptocurrencies are put into use, the global data volume will also increase exponentially. Experts estimate that data will grow 146 times over the next 15 years. The US International Trade Commission [1] predicts that the global data volume will reach 175 zettabytes (≙175,000,000,000,000,000,000,000 bytes) as early as 2025. About 8,000 data centers are currently processing, storing and connecting this enormous amount of data. For these data centers, in addition to performance and safety, optimizing energy efficiency is critical to maintaining profitability and achieving sustainability.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), ​​a provider of cloud, AI/ML, storage and 5G/edge total IT solutions , using Infineon's high-efficiency power-stage semiconductor products to meet the above requirements and realize the decarbonization of data centers. Manhtien Phan, vice president of server technology at Supermicro, said: "When developing green computing platforms, we focus on selecting vendors that share our emphasis on reducing power consumption by optimizing energy efficiency. Supermicro's solutions and Infineon's technology Combined, it reduces system power consumption, reduces overall data center power consumption, and minimizes environmental impact."

Adam White, President of the Power and Sensing Systems Division at Infineon Technologies, said: "The energy consumption of cooling systems accounts for a large part of the overall energy consumption of data centers. Infineon's TDA21490 and TDA21535 energy-efficient power semiconductor products are ideal for reducing Data center cooling problems. These semiconductor products can withstand high temperatures and have excellent reliability, which can help servers rely on natural air cooling. Using these semiconductor products can help customers further improve the power efficiency of data centers and achieve higher energy utilization efficiency." 

Adam White, President of the Power and Sensing Systems Division at Infineon Technologies

Power Usage Effectiveness (PUE) is calculated by dividing the total power delivered to the data center by the power actually consumed by IT equipment. The ideal PUE value is 1.0, that is, the entire power of the data center is used in the actual computing equipment, not for indirect equipment such as cooling or power conversion. According to the latest research[2], both IT and data center managers report that their largest data center has an annual average PUE of 1.57, this data shows that there is still room for improvement in PUE in the face of over-budget cooling and power costs, At the same time, carbon dioxide emissions are expected to be further reduced.

Supermicro's green computing platform can significantly improve PUE. Specifically, the Supermicro MicroBlade® family offers the best server density for any type of processor, integrating up to 112 single-socket Atom® nodes, 56 single-socket Xeon® nodes, and 28 single-socket Xeon® nodes in a 6U form factor Two-socket Xeon® nodes, so it can be easily deployed at scale and configured in volume with datacenter-friendly features and designs such as free air cooling, battery backup power (BBP®). Compared with standard 1U rack servers, MicroBlade can improve power efficiency by up to 86% and server density by 56%.

MicroBlade 6U

The MicroBlade server uses Infineon's OptiMOS™ integrated power stage semiconductors TDA21490 and TDA21535. The TDA21490 enables robust and reliable regulator designs for high-performance xPUs, ASICs and system-on-chips (SoCs) in server, memory, artificial intelligence and networking applications. The TDA21490 is a thermally efficient packaged OptiMOS™ power MOSFET with best-in-class efficiency. Low quiescent current drivers enable deep sleep mode to further improve light-load efficiency, and provide accurate current sensing to help greatly improve system performance. In addition to the powerful OptiMOS™ MOSFET technology, the comprehensive fault protection features of the TDA21490 further enhance the stability and reliability of the system in which it is installed.

Infineon OptiMOS™ Integrated Power Stage Semiconductor TDA21490

The TDA21535 encapsulates a low quiescent current synchronous buck gate driver IC and high-side and low-side MOSFETs at the same time, and adopts an active diode structure to achieve a low value of body diode forward voltage (Vsd) similar to a Schottky barrier diode , the reverse recovery charge is very small. The internal MOSFET current measurement algorithm with temperature compensation in the TDA21535 provides high current measurement accuracy compared to leading-edge, controller-based inductive DC resistance measurement methods. Operating at switching frequencies up to 1.5 MHz, the product achieves high-performance transient response and reduces inductance and capacitance while maintaining efficiency leadership.

Infineon OptiMOS™ Integrated Power Stage Semiconductor TDA21535