Professor Yohei Kobayashi of the University of Tokyo, together with Ajinomoto Fine-Techno (Kawasaki City) and others, developed a laser processing technology that forms microscopic holes with a diameter of 6 microns (a micron is 1 millionth of a meter) or less on semiconductor packaging substrates. With previous technologies, about 40 microns was the limit. Strive to realize the practical application of next-generation semiconductors towards miniaturization and high performance.
This is the result of joint research with Mitsubishi Electric and Spectronix (Suita City, Osaka Prefecture), which is involved in laser oscillators.
Using the technology developed this time, fine holes for wiring can be formed in Fine-Techno's insulating film. This insulating film is used to connect printed circuit boards and packaging substrates such as CPUs (Central Processing Units). Specifically, it can continuously irradiate "deep ultraviolet laser" with a wavelength of 266 nanometers (a nanometer is 1 billionth of a meter) at extremely short time intervals. The technology of the University of Tokyo, which makes full use of artificial intelligence (AI) to calculate the optimal laser irradiation method, has seen the prospect of significantly reducing the size of the hole than before.
Next-generation semiconductors that will be mass-produced after the second half of the 2020s need to reduce the diameter of wiring holes on package substrates to less than 10 microns. High-performance semiconductors will be installed in electric vehicles (EVs), etc., and the demand is expected to expand. The University of Tokyo and others will work together to promote practical use.
